Adhesive

Model: HYSOL FP6101

Features

Paste physical form separate catalyst premixed.

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Series: HYSOLFP61

Other products in the same series

Specification

  • Physical Form
    Paste
  • Quantity Within Each Unit Package
    10.000 milliliters
  • Specific Usage Design
    For underfilling chip scale packages (csps) and ball grid arrays (bgas) on circuit boards
  • Curing Method
    Heat
  • Features Provided
    Separate catalyst
  • Color
    Black
  • Supplementary Features
    10 milliliter syringe
  • NSN
    8040-01-603-7992

Other Adhesives

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44054-01
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ARALDITE 2012 A/B
NSN 8040-01-552-5889
738RTV
NSN 8040-01-260-1939
FASTBOND 30
NSN 8040-01-543-5140
P/S 590M
NSN 8040-01-023-4170
MIL-A-46146
NSN 8040-01-009-1562

What's Included?

  •  Certificate of Conformity
  •  QC Inspection prior to shipping
  •  On time delivery
  •  Friendly service to back every order

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last modified 06/26/2024