Adhesive

Model: HYSOL FP6101

Features

Paste physical form separate catalyst premixed.

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Series: HYSOLFP61

Other products in the same series

Specification

  • Physical Form
    Paste
  • Quantity Within Each Unit Package
    10.000 milliliters
  • Specific Usage Design
    For underfilling chip scale packages (csps) and ball grid arrays (bgas) on circuit boards
  • Curing Method
    Heat
  • Features Provided
    Separate catalyst
  • Color
    Black
  • Supplementary Features
    10 milliliter syringe
  • NSN
    8040-01-603-7992

Other Adhesives

MMM-A-1617-TY1-1PB
NSN 8040-01-532-0501
3549B/A
NSN 8040-01-441-4904
965
NSN 8040-01-008-0966
FM410-1-0-050IN
NSN 8040-01-446-6143
3M 75 REPOSITIONABLE ADHESIVE
NSN 8040-01-124-2651
8800-0004-85
NSN 8040-01-613-8441
FE-7007 A/B
NSN 8040-01-413-2030
A-A-3097
NSN 8040-01-203-1443

What's Included?

  •  Certificate of Conformity
  •  QC Inspection prior to shipping
  •  On time delivery
  •  Friendly service to back every order

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last modified 04/28/2024