Adhesive

Model: HYSOL FP6101

Features

Paste physical form separate catalyst premixed.

  Have a question or want to place an order? Call us at 602-926-1390

Series: HYSOLFP61

Other products in the same series

Specification

  • Physical Form
    Paste
  • Quantity Within Each Unit Package
    10.000 milliliters
  • Specific Usage Design
    For underfilling chip scale packages (csps) and ball grid arrays (bgas) on circuit boards
  • Curing Method
    Heat
  • Features Provided
    Separate catalyst
  • Color
    Black
  • Supplementary Features
    10 milliliter syringe
  • NSN
    8040-01-603-7992

Other Adhesives

CHO-BOND 584-29
NSN 8040-01-007-9151
BACF3F006J014NN
NSN 8040-01-569-7544
EP-15
NSN 8040-01-305-3127
PR-2701
NSN 8040-01-660-6832
3549B/A
NSN 8040-01-441-4904
MAGNOBOND 6398 QT
NSN 8040-01-474-0221
BB2112
NSN 8040-01-179-0043
2640214
NSN 8040-01-655-6784

What's Included?

  •  Certificate of Conformity
  •  QC Inspection prior to shipping
  •  On time delivery
  •  Friendly service to back every order

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At Aerospace-Adhesive.com we make every effort to ensure your ordering process is seamless and enjoyable. We are HAZMAT certified and ITAR registered. Our quality control team inspects every product in and out of the door before shipping to you.

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  • On-Time delivery record
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last modified 09/18/2024