Adhesive

Model: HYSOL FP6101

Features

Paste physical form separate catalyst premixed.

  Have a question or want to place an order? Call us at 602-926-1390

Series: HYSOLFP61

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Specification

  • Physical Form
    Paste
  • Quantity Within Each Unit Package
    10.000 milliliters
  • Specific Usage Design
    For underfilling chip scale packages (csps) and ball grid arrays (bgas) on circuit boards
  • Curing Method
    Heat
  • Features Provided
    Separate catalyst
  • Color
    Black
  • Supplementary Features
    10 milliliter syringe
  • NSN
    8040-01-603-7992

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001-000823-000
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THERMOSET 101
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What's Included?

  •  Certificate of Conformity
  •  QC Inspection prior to shipping
  •  On time delivery
  •  Friendly service to back every order

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last modified 07/06/2024